Facilities

 
LITHOGRAPHY

Electron beam lithography

E-beam pattern generator ZBA21 (Carl-Zeiss, Jena, Germany), 20 keV, variable shaped beam (100×100 nm2 - 6.3×6.3 µm2 shot size), 3-6 inch substrates size, small samples possibility, multilevel technology, updated by Vistec, Ltd., Jena, Germany

Control system NanoMaker (Interface, Ltd.) for SEM based lithograpy

Photolithography

(JUB 2104.16, Germany)

Resist processing

resist spinners (Convac), resist processor (APT 915), substrate cleaner (Ultratech), wet bench, resist stripping, Demi water station (W.Werner)

Data Processing

CAD software for data preparation PC IBM compatible, GDSII to DXF compilator

 
 

Inspection and Measurement

Optical microscopes

(Jenatech, Carl-Zeiss, Jena, Germany)

 

Linewidth measurements

SEM (BS-340, Tesla, Brno, Czech Republic)

 

High-resolution inspection

FE SEM (S-800, Hitachi, Japan)

 

Mask registration

mask comparator (SVG160, Carl-Zeiss, Jena, Germany)

 

Thin film thickness measurements
profilometer (Talystep, Taylor Hobson, U.K.)

 

Ellipsometer

Thin film deposition

magnetron sputtering (SCM 600, Alcatel)
e-gun evaporation (BAK5.55-3, Hochvakuum, Germany)

Clean rooms

Class 1000

 
 

Collaboration in facilities

Deep-UV lithography

Institute of Electrical Engineering, Slovak Academy od Sciences, Bratislava
www.elu.sav.sk

Dry etching

Institute of Electrical Engineering, Slovak Academy od Sciences, Bratislava
www.elu.sav.sk

SEM

Department of Experimental Physics, Fakulty of mathematics, physics and informatics, Comenius University, Bratislava
www.dep.fmph.uniba.sk

IBE

Biont, a.s., Bratislava
www.biont.sk