ACTIVITIES

We have many years practical experience in micro and nano structures pattterning, including maintenance and selfsupporting service of electron beam lithography equipment. We have been participating in numerous domestic and international projects.

 
APPLICATION ACTIVITIES

Direct electron beam writing of submicrometer (min. 200 nm) patterns on the top of various types of substrates.

Fabrication of binary photomasks for conventional and deep-UV photolithography of submicrometer structures.

Fabrication of special nonorthogonal, smoothcurved patterns and gratings for R&D.

Patterning of masks for Reactive Ion Etching (RIE).

Thin film deposition techniques - sputtering and evaporation processes.

 
MAIN RESEARCH ACTIVITIES

Practical correction of geometrical distortions by compensation of proximity, charging and thermal effects caused by electron scattering in the electron beam writing process (exposure optimization).

Methods of technological treatments of electron beam sensitive films before and after an optimal patterns exposure.

Estimation of the main lithographic parameters of new and commercial (single and/or multilayer) resist systems for micro and nano lithography.

Inspection and measuring methods of resulting high resolution submicro and nanometer 3D relief structures.

Practical realization of multilayer resist relief masks direct on the top of various wafer types according to the individual requirements.

Special deposition techniques (patented and know-how oriented) with determination of residual stress in layers also on the top of thin membranes (for example carbon-layers) on large-area Open-Stencil Masks).